PIAM : http://www.pimaterials.com/chn/
PIAM : Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation and industrial power generation.
<Characteristics>
ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label
Type: GF GV GD
PI膜(PI Film)
PI膜(PI Film)
PI膜(PI Film)
Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation and industrial power generation.
ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label
Type: GF GV GD
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation and industrial power generation.
ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label
Type: GF GV GD
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