全部產品介紹
-
MORE
三合一壓合材料(Three-in-one Lamination Material)三合一壓合材料(Three-in-one Lamination Material)
三合一壓合材料(Three-in-one Lamination Material) -
MORE
TCAT RA Copper FoilTCAT RA Copper Foil
GS系列銅箔產品
高頻高速低傳輸損耗產品
High Frequency Lower Transmission Loss Product -
MORE
IPCO 鋼帶 & DBP鋼帶壓合機IPCO 鋼帶 & DBP鋼帶壓合機
IPCO 鋼帶 & DBP鋼帶壓合機:
(A)鋼帶:
超鏡面拋光鋼帶應用領域: 光學薄膜、PI膜、FCCL 2-Layer etc.
適用於FCCL 2-Layer生產，具有絕佳的鋼帶品質與工藝，確保長期FCCL產品生產質量。
(B)DBP鋼帶壓合機:
Isochoric = Gap controlled 等容壓合 -
MORE
不銹鋼祛水器(Stainless Steel Steam Trap)不銹鋼祛水器(Stainless Steel Steam Trap)
新產品開發---袪水器
節能減碳新利器，減少燃料，降低CO2排放，蒸氣運作成本降低。
祛水器是固定式噴嘴，可連續排出冷凝水。 -
MORE
PI膜(PI Film)PI膜(PI Film)
Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation and industrial power generation.
ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label
Type: GF GV GD -
MORE
補強板(Stiffener)補強板(Stiffener)
聚亞醯胺複合補強膠片
* 產品規格 :
* 材質說明 :
PI複合材厚度：3~9 mil
接著劑種類及厚度：改質環氧樹脂，25~37.5um
* 產品特色 :
◎ 優良的耐燃性(耐燃等級：UL 94V-0、UL File No. E242399)
◎ 優良的接著性
◎ 優良的耐熱性
◎ 優良的耐化性 -
MORE
PIAM PI VarnishPIAM PI Varnish
Advanced P Materials
PI Varnish for Semiconductor
PI Advanced Materials develops and supplies basic materials for future industries such as display,
electric car, and secondary battery industry based on the accumulated varnish
production technology accumulated in PI film production.
Characteristics ㆍSuperior Thermal & Dimensional Stability
ㆍMatching CTE with Semiconductor Materials
Application ㆍSemiconductor
VS-A VS-S VS-E
