聚醯亞胺材料(Polyimide; PI)

PI聚醯亞胺膠帶(KA200)/PI Tape(KA200)
聚醯亞胺膜的化學性質穩定，具良好的耐熱性、耐化學性，阻燃性佳，電氣絕緣性佳。
可應用於 可應用在高溫或其他嚴苛的環境，比如電機的槽絕緣及電纜繞包。
搭配矽膠使醯亞胺膠帶可耐溫達 200℃，且撕除不殘膠。
低可燃性，介電強度達 5.2kV。 UL 認證符合客戶端的需求。
適用於各產業用途，廣泛使用於電子產品製程，例如 PCB 製程保護 、QFN 封裝等

Polyimide Film for FCCL and FPCs
PI Advanced Materials is supplying PI film as basic material for various fields such as smartphone, semiconductor, IT industry, space, aviation and industrial power generation.


ㆍHigh Thermal Properties
ㆍMatching CTE with Copper
ㆍ A variety of Thickness (5~75um)
ㆍ FCCL, Coverlay, Stiffener
ㆍInsulating Tape,Label

Type: GF GV GD

聚亞醯胺複合補強膠片
* 產品規格 :
* 材質說明 :
PI複合材厚度：3~9 mil
接著劑種類及厚度：改質環氧樹脂，25~37.5um
* 產品特色 :
◎ 優良的耐燃性(耐燃等級：UL 94V-0、UL File No. E242399)
◎ 優良的接著性
◎ 優良的耐熱性
◎ 優良的耐化性

Advanced P Materials
PI Varnish for Semiconductor
PI Advanced Materials develops and supplies basic materials for future industries such as display,
electric car, and secondary battery industry based on the accumulated varnish
production technology accumulated in PI film production.
Characteristics ㆍSuperior Thermal & Dimensional Stability
ㆍMatching CTE with Semiconductor Materials
Application ㆍSemiconductor
VS-A VS-S VS-E